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Notebook PCB ASPs expected to raise on shift to HDI boards
Click:0 From:Hitech Circuits Co.,Limited Date:2009-04-10
 
Taiwan's PCB manufacturers expect the shift to high-density interconnect (HDI) boards (HDI PCB) to help raise the ASPs of notebook PCBs, and are looking forward to the upcoming launch of ultra-thin notebooks based on Intel's CULV (consumer ultra low votage) CPUs.
 
Upcoming notebooks incorporating CULV CPUs are expected to spur demand for HDI boards, said the makers, adding that rising shipments of the high-ASP segment will be able to drive up notebook PCB prices and stabilize the ideal price range.
 
Citing company sources, market watchers estimate PCB Manufacturer HitechPCB Technology will see the sales contribution from HDI boards grow to 6% this year from 3% in 2008.
 
PCB Manufacturing--HITECHPCB has also scheduled to kick off its initial shipments for CULV-based notebooks in the second quarter, and its utilization rate of HDI PCB boards (with a monthly capacity of around 100,000 square feet) has been pushed up signficantly, the watchers said.
 
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