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Embedded components on Multilayer PCB
Click:0 From:Hitech Circuits Co.,Limited Date:1998-03-22
 
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The technology for embedding components into PCBs has been around in Europe since 1996. However, it had never been fully adopted.
This situation begins to change, as a considerable number of components have been developed that could be embedded into PCBs. Schweizer electronics showed one example at this year’s EIPC Summer Conference - where the silicon could be introduced into the middle of the board.
The Hermes-Project - supported by the European Commission - is another example (showing that several layers of silicon had been incorporated inside the PCB); Murata’s technology for embedding capacitors into a board (the components could be soldered into the board or connected via a plating process), etc.
Many companies - such as Infineon, the Frauenhofer Institute, NXP, IMEC, Murata or IZM - now work to embed components into boards, Mr Michael Weinhold stated.
The future outlook for embedding components into PCB’s was promising. As the technology offers advantages - such as reduced cost through miniaturisation, improved performance and increased reliability - it is bound to get more attention throughout the industry.
 
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