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HITECHPCB provides ZTE with advanced PCBs for 3G data card application
Click:0 From:Hitech Circuits Co.,Limited Date:2009-05-30
 
Leading-edge technology also asks for HitechPCBs. This is also true for 3G data cards - such as ZTE’s MU350, the smallest dual-mode (TD-HSDPA/TD-CDMA) data card currently available on the market. HITECHPCB provides ZTE with high-end PCBs for this device.
 
ZTE has been relying on the quality and services of HITECHPCB’s products for more than one year. Within this cooperation, HITECHPCB mainly focuses on ZTE’s 3G data card applications - the MU350 which is the smallest obtainable dual-mode (TD-HSDPA/TD-CDMA) data card. Due to its size and the highly complex components, the data card requires a high-end HDI-PCB, High density PCB, High Density Interconnect PCBs, HDI PCBs with up to 3 laser structured layers on each side. They are manufactured at HITECHPCB’s largest plant in Shanghai.
 
The MU350, a wireless Internet access card launched in 2008, delivers a peak data rate of up to 2.8Mbps. It is now the world's most compact TD-HSDPA/TD-CDMA data card with only 31 grams in weight.
 
HitechPCB Product type:
 
Hitechpcb Contact way:
Skype: hitechpcb
           www.hitechpcb.com
 
 
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