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Compétences
Circuit imprimé rigide
Circuit imprimé souple
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Item
Mass Production
Sample
Max. Layers
20layers
26layers
Max. Board Size
21"x24"
24"x40"
Material
FR4,High Tg, Bergquist material, PT material, etc.
Rogers, Nelco, Telfon, etc.
Max. Board Thickness
6.0mm
8.0mm
Min. Core Thickness
0.10mm
0.075mm
Min. Track Width/Space
3.5mil/3.5mil
2.5mil/2.5mil
Max. Copper Thickness
Inner Layer: 6Oz
Inner Layer: 8Oz
 
Outer Layer: 8Oz
Outer Layer: 10 Oz
Min. Drill Size
0.2mm
0.15mm
Min. Laser Drill Size
0.1mm
0.076mm
PTH Diameter Tolerance
±3mil
±2mil
Aspect Ratio
10:1
15:1
PTH Wall Thickness
18um-25um
16um-35um
Min solder mask bridge
0.13mm
0.10mm
Min solder mask window
0.10mm
0.08mm
V-cutting Tolerance
±0.13mm
±0.10mm
Outline Dimension
±0.13mm
±0.10mm
Warp and Twist
≤0.7%
≤0.5%
Plating Hard Gold
50”
200”
Controlled Impedance
±10%
±7%
HDI Board
1+N+1, 1+1+N+1+1
2+N+2,  3+N+3
Surface Treatment
HASL
HASL
Surface Treatment
HASL Lead Free
HASL Lead Free
Immersion Gold
Immersion Gold
Immersion Tin
Immersion Tin
Immersion Silver
Immersion Silver
Flash Gold
Flash Gold
OSP
OSP
Gold Finger
Gold Finger
Selective hard gold
Selective hard gold

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

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